| Statement |
- Date of occurrence of the event:2021/04/20
- Company name:Nanya Technology Corporation
- Relationship to the Company (please enter ”head office” or ”subsidiaries”):head office
- Reciprocal shareholding ratios:N/A
- Cause of occurrence:Nanya Technology plans to construct a new 12-inch advanced semiconductor fabrication plant with a double-deck cleanroom
- Countermeasures:N/A
- Any other matters that need to be specified:
Nanya Technology today announced that the company plans to construct a new 12-inch advanced semiconductor fabrication plant with a double-deck cleanroom in Taishan Nanlin Technology Park in New Taipei City with supports by New Taipei City Government and Central Government agencies. The plant will produce DRAM chips with Nanya's independent developed 10nm class process technologies and will deploy extreme ultraviolet (EUV) lithography technology, with a monthly production capacity of approximately 45,000 wafers. This will provide 2,000 new high-tech jobs while supporting thousands of additional indirect job opportunities. The investment plan will take three phases within seven years. The company expects to break ground in late 2021, targets to complete the construction in 2023 with volume production in 2024, the total investment is approximate NTD 300 billion.
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