2026/10/01

Nanya Technology to Build 3D Wafer Packaging and Testing Fab in Pingtung Science Park

Taipei, October 1, 2026, Nanya Technology Corporation has received approval from Taiwan's National Science and Technology Council (NSTC) to establish a 3D wafer packaging and testing fab in Pingtung Science Park.

The new fab will incorporate advanced 3D IC technologies, including through-silicon via (TSV) and wafer stacking, to develop integrated wafer-level packaging and testing capabilities for high-performance and high-bandwidth memory solutions driven by the rapid expansion of AI applications.